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dc.contributor.authorChakraborty, Shounak
dc.contributor.authorSharma, Yanshul
dc.contributor.authorMoulik, Sanjay
dc.date.accessioned2024-05-27T11:34:50Z
dc.date.available2024-05-27T11:34:50Z
dc.date.created2024-05-09T23:33:06Z
dc.date.issued2024
dc.identifier.citationACM Transactions on Embedded Computing Systems. 2024, .en_US
dc.identifier.issn1539-9087
dc.identifier.urihttps://hdl.handle.net/11250/3131531
dc.description.abstractThe recent shift in the VLSI industry from conventional MOSFET to FinFET for designing contemporary chip-multiprocessor (CMP) has noticeably improved hardware platforms’ computing capabilities, but at the cost of several thermal issues. Unlike the conventional MOSFET, FinFET devices experience a significant increase in circuit speed at a higher temperature, called temperature effect inversion (TEI), but higher temperature can also curtail the circuit lifetime due to self-heating effects (SHEs). These fundamental thermal properties of FinFET introduced a new challenge for scheduling time-critical tasks on FinFET based multicores that how to exploit TEI towards improving performance while combating SHEs. In this work, TREAFET, a temperature-aware real-time scheduler, attempts to exploit the TEI feature of FinFET based multicores in a time-critical computing paradigm. At first, the overall progress of individual tasks is monitored, tasks are allocated to the cores, and finally, a schedule is prepared. By considering the thermal profiles of the individual tasks and the current thermal status of the cores, hot tasks are assigned to the cold cores and vice-versa. Finally, the performance and temperature are balanced on-the-fly by incorporating a prudential voltage scaling towards exploiting TEI while guaranteeing the deadline and thermal safety. Moreover, TREAFET stimulates the average runtime frequency by employing an opportunistic energy-adaptive voltage spiking mechanism, in which energy saving during memory stalls at the cores is traded off during the time slice having the spiked voltage. Simulation results claim TREAFET maintains a safe and stable thermal status (peak temperature below 80°C) and improves frequency up to 17% over the assigned value, which ensures legitimate time-critical performance for a variety of workloads while surpassing a state-of-the-art technique. The stimulated frequency in TREAFET also finishes the tasks early, thus providing opportunities to save energy by power gating the cores, and achieves a 24% energy delay product (EDP) gain on average.en_US
dc.language.isoengen_US
dc.publisherACMen_US
dc.rightsNavngivelse 4.0 Internasjonal*
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/deed.no*
dc.titleTREAFET: Temperature-Aware Real-Time Task Scheduling for FinFET based Multicoresen_US
dc.title.alternativeTREAFET: Temperature-Aware Real-Time Task Scheduling for FinFET based Multicoresen_US
dc.typePeer revieweden_US
dc.typeJournal articleen_US
dc.description.versionacceptedVersionen_US
dc.source.pagenumber29en_US
dc.source.journalACM Transactions on Embedded Computing Systemsen_US
dc.identifier.doi10.1145/3665276
dc.identifier.cristin2267431
dc.relation.projectEC/H2020/898296en_US
cristin.ispublishedfalse
cristin.fulltextpostprint
cristin.qualitycode1


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