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dc.contributor.authorMohamed, Marshed Kassim
dc.contributor.authorMaiseli, Baraka
dc.contributor.authorAi, Yun
dc.contributor.authorMkocha, Khadija
dc.contributor.authorAl-Samman, Ahmed
dc.date.accessioned2021-10-27T10:45:36Z
dc.date.available2021-10-27T10:45:36Z
dc.date.created2021-07-08T15:44:04Z
dc.date.issued2021
dc.identifier.citationIEEE Electromagnetic Compatibility Magazine. 2021, 10 (2), 47-52.en_US
dc.identifier.issn2162-2264
dc.identifier.urihttps://hdl.handle.net/11250/2825955
dc.description.abstractWireless body area networks (WBANs) consist of interconnected devices that monitor the human body functions and the surrounding environment. Of these sensors, implants encounter multiple challenges due to their invasive nature. In addition, the transmission channel of the implants involves living tissues that pose practical challenges in channel modeling. Despite several promising applications of implants in the healthcare industry, there have been insufficient comprehensive reviews that extensively describe trends and challenges of this technology. This work reviews in-body WBANs and presents critical challenges that hinder advancement and application of the technology. We also discuss possible solutions that may be useful to realize in-body WBANs practically.en_US
dc.language.isoengen_US
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en_US
dc.relation.urihttps://ieeexplore.ieee.org/document/9477235
dc.titleIn-Body Sensor Communication: Trends and Challengesen_US
dc.typePeer revieweden_US
dc.typeJournal articleen_US
dc.description.versionacceptedVersionen_US
dc.rights.holder© IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en_US
dc.source.pagenumber47-52en_US
dc.source.volume10en_US
dc.source.journalIEEE Electromagnetic Compatibility Magazineen_US
dc.source.issue2en_US
dc.identifier.doi10.1109/MEMC.2021.9477235
dc.identifier.cristin1921059
cristin.ispublishedtrue
cristin.fulltextpostprint
cristin.qualitycode1


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