Browsing Institutt for konstruksjonsteknikk by Journals "Journal of Electronic Materials"
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Contact Resistance and Metallurgical Connections Between Silver Coated Polymer Particles in Isotropic Conductive Adhesives
(Journal article; Peer reviewed, 2016)Recently, there has been an increasing interest in silver thin film coated polymer spheres as conductive fillers in isotropic conductive adhesives (ICAs). Such ICAs yield resistivities similar to conventional silver flake ... -
Resistance Analysis of Spherical Metal Thin Films Combining Van Der Pauw and Electromechanical Nanoindentation Methods
(Journal article; Peer reviewed, 2018)Although micron-sized metal-coated polymer particles are an important conductive filler material in anisotropic conductive adhesives, the resistance of the particles in adhesive is not well understood. In this study, a van ... -
Room-Temperature Curing and Grain Growth at High Humidity in Conductive Adhesives with Ultra-Low Silver Content
(Journal article; Peer reviewed, 2017)Isotropic conductive adhesives (ICAs) are alternatives to metallic solders as interconnects in solar modules and electronic devices, but normally require silver contents >25 vol.% and elevated curing temperatures to achieve ...