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dc.contributor.authorWang, Shaoquan
dc.contributor.authorSæter, Erik
dc.contributor.authorLasn, Kaspar
dc.date.accessioned2022-03-10T13:03:06Z
dc.date.available2022-03-10T13:03:06Z
dc.date.created2021-10-13T21:39:47Z
dc.date.issued2021
dc.identifier.citationSensors. 2021, 21 (20), .en_US
dc.identifier.issn1424-8220
dc.identifier.urihttps://hdl.handle.net/11250/2984297
dc.description.abstractStructural health monitoring (SHM) is a challenge for many industries. Over the last decade, novel strain monitoring methods using optical fibers have been implemented for SHM in aerospace, energy storage, marine, and civil engineering structures. However, the practical attachment of optical fibers (OFs) to the component is still problematic. While monitoring, the amount of substrate strain lost by the OF attachment is often unclear, and difficult to predict under long-term loads. This investigation clarifies how different attachment methods perform under time-dependent loading. Optical fibers are attached on metal, thermoset composite, and thermoplastic substrates for distributed strain sensing. Strains along distributed optical fiber sensors (DOFS) are measured by optical backscatter reflectometry (OBR) and compared to contact extensometer strains under tensile creep loading. The quality of the bondline and its influence on the strain transfer is analyzed. Residual strains and strain fluctuations along the sensor fiber are correlated to the fiber attachment method. Results show that a machine-controlled attachment process (such as in situ 3-D printing) holds great promise for the future as it achieves a highly uniform bondline and provides accurate strain measurements.en_US
dc.language.isoengen_US
dc.publisherMDPIen_US
dc.rightsNavngivelse 4.0 Internasjonal*
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/deed.no*
dc.titleComparison of DOFS attachment methods for time dependent strain sensingen_US
dc.typePeer revieweden_US
dc.typeJournal articleen_US
dc.description.versionpublishedVersionen_US
dc.source.pagenumber27en_US
dc.source.volume21en_US
dc.source.journalSensorsen_US
dc.source.issue20en_US
dc.identifier.doi10.3390/s21206879
dc.identifier.cristin1945781
cristin.ispublishedtrue
cristin.fulltextoriginal
cristin.qualitycode1


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