Achieving high-strength metallurgical bonding between A356 aluminum and copper through compound casting
Peer reviewed, Journal article
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Due to stable surface oxides on the solid copper surface and the ease of forming Al2O3 films at the aluminum melt surface, it is difficult to achieve high-strength metallurgical bonding between the two materials through compound casting. In this research, a novel surface coating method for the copper inserts, namely hot-dip Sn-coating, has been applied. Through this method, a high-quality bond between a cast aluminum alloy A356 and commercially pure copper was achieved through a gravity compound casting process. Tensile tests showed that a maximum ultimate tensile strength (UTS) of 90.8 MPa could be obtained for the bimetal interface. Microstructures formed in the aluminum/copper interface were studied by optical- and scanning electron microscopy, while a sessile drop wetting test was used to study the wettability between the aluminum melt and Sn-coated copper substrates. The effects of Sn-coating on the wettability and the formation of interfacial microstructure were discussed.