Vis enkel innførsel

dc.contributor.authorZhao, Jian
dc.contributor.authorShi, Mingxiao
dc.contributor.authorLi, Yanjun
dc.contributor.authorMa, Xiang
dc.contributor.authorFang, Zhenxing
dc.contributor.authorYan, Hua
dc.date.accessioned2021-03-15T14:50:17Z
dc.date.available2021-03-15T14:50:17Z
dc.date.created2021-01-18T13:47:27Z
dc.date.issued2020
dc.identifier.issn0169-4243
dc.identifier.urihttps://hdl.handle.net/11250/2733485
dc.description.abstractCu interlayers with thicknesses of 1, 1.5, and 2 mm were used to join niobium and AISI 304 steel. Fractures occurred in the weld, the Nb base metal, and the unmelted Cu interlayer when the Cu interlayer thickness was 1, 1.5, and 2 mm, respectively. When the thickness of the Cu interlayer was 1 mm, the weld microstructure consisted of austenite with Cu-rich particles along the austenitic grain boundaries and within the austenitic grains, a composite-like structure (the Fe2Nb lamellae and particles in a γ matrix) embedded with coarse Cu globules, and a mixture of bulk Fe7Nb6, Nb-rich dendrites, and Cu matrix. The bulk brittle Fe7Nb6 phase embrittled the joint. However, when the thickness of the Cu interlayer was 1.5 mm, the weld microstructure consisted of austenite with Cu-rich precipitates along the austenitic grain boundaries and a Cu-rich phase embedded with Nb-rich particles and dendrites. Solid-solution strengthening of Cu by Fe was responsible for the improved mechanical properties of the joint. The mixture of Nb-rich particles and dendrites in the Cu matrix was also helpful in enhancing the joint strength. Furthermore, when the thickness of the Cu interlayer was 2 mm, the weld microstructure consisted of austenite with Cu-rich precipitates along the austenitic grain boundaries and within the austenitic grains, an unmelted Cu interlayer, and Nb-rich particles and dendrites embedded in a Cu matrix. The unmelted Cu interlayer reduced the joint strength.en_US
dc.language.isoengen_US
dc.publisherTaylor and Francisen_US
dc.titleLaser welding of niobium to AISI 304 steel using a copper interlayeren_US
dc.typePeer revieweden_US
dc.typeJournal articleen_US
dc.description.versionacceptedVersionen_US
dc.source.journalJournal of Adhesion Science and Technologyen_US
dc.identifier.cristin1873278
dc.description.localcodeLocked until 24/4-2021 due to copyright restrictions. This is an accepted manuscript of an article published by Taylor & Francis, available at http://dx.doi.org/https://doi.org/10.1080/01694243.2020.1754619en_US
cristin.ispublishedtrue
cristin.fulltextpostprint
cristin.qualitycode1


Tilhørende fil(er)

Thumbnail

Denne innførselen finnes i følgende samling(er)

Vis enkel innførsel