Blar i NTNU Open på forfatter "Redford, Keith"
-
Controlling the Conduction Mechanisms in Isotropic Conductive Adhesives with Silver-Coated Polymer Spheres
Pettersen, Sigurd Rolland; Kristiansen, Helge; Redford, Keith; Helland, Susanne; Kalland, Erik; Zhang, Zhiliang; He, Jianying (Journal article; Peer reviewed, 2016)Replacing the silver flakes in conventional isotropic conductive adhesives (ICAs) with micron sized polymer spheres coated with tens to hundreds nanometer of silver (AgPS) drastically reduces the silver content required ... -
Crosslinking effect on the deformation and fracture of monodisperse polystyrene-co-divinylbenzene particles
He, Jianying; Zhang, Zhiliang; Kristiansen, Helge; Redford, Keith; Fonnum, Geir; Modahl, Grete (Journal article; Peer reviewed, 2013)This study focuses on the effect of crosslinking density on the mechanical response of polystyrene-co-divinylbenzene (PS-DVB) particles under compression by means of nanoindentation-based flat punch method combined with ... -
Electrical four-point probing of spherical metallic thin films coated onto micron sized polymer particles
Pettersen, Sigurd Rolland; Stokkeland, August Emil; Kristiansen, Helge; njagi, john; Redford, Keith; Goia, Dan; Zhang, Zhiliang; He, Jianying (Journal article; Peer reviewed, 2016)Micron-sized metal-coated polymer spheres are frequently used as filler particles in conductive composites for electronic interconnects. However, the intrinsic electrical resistivity of the spherical thin films has not ... -
Room-Temperature Curing and Grain Growth at High Humidity in Conductive Adhesives with Ultra-Low Silver Content
Pettersen, Sigurd Rolland; Redford, Keith; njagi, john; Kristiansen, Helge; Helland, Susanne; Kalland, Erik; Goia, Dan; Zhang, Zhiliang; He, Jianying (Journal article; Peer reviewed, 2017)Isotropic conductive adhesives (ICAs) are alternatives to metallic solders as interconnects in solar modules and electronic devices, but normally require silver contents >25 vol.% and elevated curing temperatures to achieve ... -
Size effect on mechanical properties of micron-sized PS-DVB polymer particles
He, Jianying; Zhang, Zhiliang; Midttun, M; Fonnum, Geir; Modahl, GI; Kristiansen, H; Redford, Keith (Journal article; Peer reviewed, 2008)A nanoindentation based flat punch method has been developed to determine the stress-strain behaviour of single micron-sized Ugelstad polystyrene-co-divinylbenzene (PS-DVB) particles in compression. Five groups of particles ...