Browsing NTNU Open by Author "Mielnik, Michal Marek"
Now showing items 1-5 of 5
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Biocompatible bonding of a rigid off-stoichiometry thiol-ene-epoxy polymer microfluidic cartridge to a biofunctionalized silicon biosensor
Sønstevold, Linda; Yadav, Mukesh; Arnfinnsdottir, Nina Bjørk; Herbjørnrød, Aina Kristin; Jensen, Geir Uri; Aksnes, Astrid; Mielnik, Michal Marek (Journal article; Peer reviewed, 2022) -
Curved passive mixing structures: a robust design to obtain efficient mixing and mass transfer in microfluidic channels
Øvreeide, Ingrid Haga; Zoellner, Andreas; Mielnik, Michal Marek; Stokke, Bjørn Torger (Peer reviewed; Journal article, 2021)Analyte mixing and delivery to a functionalized sensor surface are important to realize several advantages associated with biosensors integrated with microfluidic channels. Here, we present a comparison between a herringbone ... -
High aspect ratio deep RIE for novel 3D radiation sensors in high energy physics applications
Kok, Angela; Hansen, Thor-Erik; Hansen, Trond Andreas; Jensen, Geir Uri; Lietaer, Nicolas; Mielnik, Michal Marek; Storås, Preben (Journal article; Peer reviewed, 2009)3D detectors with electrodes penetrating through the entire silicon substrate have many advantages over conventional planar silicon technology, for example, high radiation tolerance. High aspect ratio through-wafer holes ... -
Microfluidic channels for biomedical diagnostic devices
Øvreeide, Ingrid Haga (Doctoral theses at NTNU;2021:54, Doctoral thesis, 2021)Disease detection is of utmost importance for initiating appropriate treatment and efficient preventative measures. Therefore, providing an inexpensive, fast and robust alternative to the current detection techniques, ... -
Technologies enabling 3D stacking of MEMS
Taklo, Maaike Margrete Visser; Mielnik, Michal Marek; Schjølberg-Henriksen, Kari; Storås, Preben; Tofteberg, Hannah Rosquist; Lietaer, Nicolas; Johannessen, Rolf (Chapter, 2010)In order to realize reliable 3D stacking of micro electromechanical systems (MEMS), interconnection and through wafer via technologies have been adapted from other areas and verified ...