• High aspect ratio deep RIE for novel 3D radiation sensors in high energy physics applications 

      Kok, Angela; Hansen, Thor-Erik; Hansen, Trond Andreas; Jensen, Geir Uri; Lietaer, Nicolas; Mielnik, Michal Marek; Storås, Preben (Conference object; Journal article; Peer reviewed, 2009)
      3D detectors with electrodes penetrating through the entire silicon substrate have many advantages over conventional planar silicon technology, for example, high radiation tolerance. High aspect ratio through-wafer holes ...