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dc.contributor.authorWang, Rui
dc.contributor.authorCheng, Hua
dc.contributor.authorGong, Yi
dc.contributor.authorwang, fengyu
dc.contributor.authording, xin
dc.contributor.authorhu, rui
dc.contributor.authorZhang, Xian
dc.contributor.authorHe, Jianying
dc.contributor.authorTian, Xingyou
dc.date.accessioned2019-10-24T08:28:09Z
dc.date.available2019-10-24T08:28:09Z
dc.date.created2019-10-18T06:37:46Z
dc.date.issued2019
dc.identifier.issn1944-8244
dc.identifier.urihttp://hdl.handle.net/11250/2624062
dc.description.abstractThermally conductive polymer packaging material is of great significance for the thermal management of electronics. Inorganic thermally conductive fillers have been demonstrated as a convenient approach to achieve this goal, however, sacrificing the lightweight and processability of the polymer. To address this problem, effective 3D boron nitride (BN) network was constructed as heat conduction pathway in polystyrene (PS) matrix based on oil-water interface assembly in this work. Styrene oil droplets were stabilized by BN sheets in water phase to form Pickering emulsions, and then the in-situ polymerization was trigged to synthesize PS microspheres with ultrathin BN layer covered surface (PS@BN microspheres). Composite substrates were fabricated through hot-compressing the PS@BN microspheres to form BN networks based on the original microsphere template. Benefited from the network structure, the maximum thermal conductivity of composite substrate reached 0.94 W/mK at 33.3 wt% BN, which is 626% folds of that of pure polystyrene. It was also demonstrated that the storage modulus and thermal stability of the composite substrate were dramatically improved by the BN network. The reported composite substrate and its fabrication strategy are promising in the development of thermal management of electronics.nb_NO
dc.language.isoengnb_NO
dc.publisherAmerican Chemical Societynb_NO
dc.titleHighly Thermally Conductive Polymer Composite Originated from Assembly of Boron Nitride at Oil Water Interfacenb_NO
dc.typeJournal articlenb_NO
dc.typePeer reviewednb_NO
dc.description.versionacceptedVersionnb_NO
dc.source.journalACS Applied Materials & Interfacesnb_NO
dc.identifier.doi10.1021/acsami.9b15259
dc.identifier.cristin1738212
dc.relation.projectNorges forskningsråd: 251068nb_NO
dc.description.localcodeLocked until 17.10.2020 due to copyright restrictions. This document is the Accepted Manuscript version of a Published Work that appeared in final form in [ACS Applied Materials & Interfaces], copyright © American Chemical Society after peer review and technical editing by the publisher. To access the final edited and published work see [insert ACS Articles on Request author-directed link to Published Work, see http://pubs.acs.org/page/policy/articlesonrequest/index.html].”nb_NO
cristin.unitcode194,64,45,0
cristin.unitnameInstitutt for konstruksjonsteknikk
cristin.ispublishedtrue
cristin.fulltextpostprint
cristin.qualitycode1


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