Preparation of low density organosilica monoliths containing hollow silica nanospheres as thermal insulation materials
Journal article, Peer reviewed
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Original versionMaterials letters (General ed.). 2019, 250 151-154. 10.1016/j.matlet.2019.05.021
In this study, we demonstrated that low density organosilica monoliths (LDM) containing hollow silica nanospheres (HSNS) may have a great potential for the use as thermal insulation materials. First, hydrophilic and hydrophobic HSNS have been prepared by a simple sol-gel method and have an average diameter centered around 120 nm and a shell thickness between 10 and 15 nm. LDM containing HSNS have then been prepared as solid cylindric materials without cracks and with a low bulk density of about 0.17 g/cm3. LDM containing hydrophobic HSNS have shown a measured thermal conductivity of about 0.031 W/(mK), compared to 0.045 W/(mK) of the corresponding LDM without HSNS.