Browsing Institutt for materialteknologi by Journals "Engineering Science and Technology, an International Journal (JESTECH)"
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Capillary forces as a limiting factor for sawing of ultrathin silicon wafers by diamond multi-wire saw
(Peer reviewed; Journal article, 2020)Succeeding with ultrathin silicon wafer sawing by diamond multi-wire saw, is not only a matter of optimization; the challenges of thin wafer production and the capability limit have not yet been fully understood. In this ...