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dc.contributor.authorPanin, Alexey V.
dc.contributor.authorKazachenok, Marina S.
dc.contributor.authorSinyakova, Elena A.
dc.contributor.authorBuiluk, Artem O.
dc.contributor.authorMartynov, Sergey A.
dc.contributor.authorPanin, Sergey
dc.contributor.authorBerto, Filippo
dc.date.accessioned2024-01-17T13:22:06Z
dc.date.available2024-01-17T13:22:06Z
dc.date.created2021-12-02T09:15:47Z
dc.date.issued2021
dc.identifier.citationMaterial Design & Processing Communications (MDPC). 2021, 3 (1), .en_US
dc.identifier.issn2577-6576
dc.identifier.urihttps://hdl.handle.net/11250/3112211
dc.description.abstractThis paper addresses the problem of enlarging the strength of Ti-6Al-4V titanium parts fabricated by wire-based electron-beam additive manufacturing (EBAM) technology. The investigations on microstructure and phase composition of wire-based EBAM Ti-6Al-4V samples as well the as EBAM TiCx/Ti-6Al-4V ones fabricated by electron beam melting of titanium Ti-6Al-4V wire with simultaneous supply of TiC powder were performed. It is shown that adding of TiC powder into a molten pool significantly affects the microstructure and volume fraction of retained β phase in the EBAM-built parts. The main conclusion made postulates that the combination of wire feeding–based EBAM and direct metal deposition technology, which utilizes a feed nozzle to supply the ceramic powder into a molten pool, provides an ample opportunity to produce EBAM TiCx/Ti-6Al-4V samples with increased microhardness and tensile strength.en_US
dc.language.isoengen_US
dc.publisherWileyen_US
dc.titleImproving mechanical properties of wire-based EBAM Ti-6Al-4V parts by adding TiC powdersen_US
dc.title.alternativeImproving mechanical properties of wire-based EBAM Ti-6Al-4V parts by adding TiC powdersen_US
dc.typePeer revieweden_US
dc.typeJournal articleen_US
dc.description.versionpublishedVersionen_US
dc.rights.holderThis version will not be available due to the publisher's copyright.en_US
dc.source.pagenumber6en_US
dc.source.volume3en_US
dc.source.journalMaterial Design & Processing Communications (MDPC)en_US
dc.source.issue1en_US
dc.identifier.doi10.1002/mdp2.136
dc.identifier.cristin1963127
cristin.ispublishedtrue
cristin.fulltextoriginal
cristin.qualitycode1


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